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7.6 Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing

机译：7.6用于基于膜的晶圆级同时测试的电容耦合非接触探测电路

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Mutsuo Daito; Yoshiro Nakata; Satoshi Sasaki; Hiroyuki Gomyo; Hideki Kusamitsu; Yoshio Komoto; Kunihiko Iizuka; Katsuyuki Ikeuchi; Gil Su Kim; Makoto Takamiya; Takayasu Sakurai;
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1. Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing [J] . Daito M., Nakata Y., Sasaki S., Solid-State Circuits, IEEE Journal of . 2011,第10期

机译：电容耦合的非接触式探测电路，用于基于膜的晶圆级同时测试
2. A 40 nm CMOS I/O Pad Design With Embedded Capacitive Coupling Receiver for Non-Contact Wafer Probe Test [J] . Scarselli Eleonora Franchi, Perilli Luca, Perugini Luca, Circuits and Systems I: Regular Papers, IEEE Transactions on . 2015,第7期

机译：具有嵌入式电容耦合接收器的40 nm CMOS I / O焊盘设计，用于非接触式晶圆探针测试
3. 6 W/25 mm~2 Wireless Power Transmission for Non-contact Wafer-Level Testing [J] . Andrzej RADECKI, Hayun CHUNG, Yoichi YOSHIDA, IEICE Transactions on Electronics . 2012,第4期

机译：6 W / 25 mm〜2无线电源传输，用于非接触晶圆级测试
4. Capacitively coupled non-contact probing circuits for membrane-based wafer-level simultaneous testing [C] . Daito M., Nakata Y., Sasaki S., Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2010 . 2010

机译：电容耦合的非接触式探测电路，用于基于膜的晶圆级同时测试
5. Flip chip testing with a capacitive coupled probe chip. [D] . Stanaski, Andrew John. 2003

机译：使用电容耦合探针芯片进行倒装芯片测试。
6. Ultra-Capacitive Carbon Neural Probe Allows Simultaneous Long-Term Electrical Stimulations and High-Resolution Neurotransmitter Detection [O] . Surabhi Nimbalkar, Elisa Castagnola, Arvind Balasubramani, -1

机译：超电容碳神经探针可同时进行长期电刺激和高分辨率神经递质检测
7. Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing [O] . Mutsuo Daito, Yoshiro Nakata, Satoshi Sasaki, 2015

机译：用于基于膜的晶圆级同时测试的电容耦合非接触探测电路
8. Evaluation of a Capacitively-Coupled, Non-Contact (through Clothing) Electrode or ECG Monitoring and Life Signs Detection for the Objective Force Warfighter [R] . Lee, J. M. , Pearce, F. , Hibbs, A. D. , 2004

机译：对目标力量战士的电容耦合，非接触（通过衣物）电极或ECG监测和生命体征检测的评估

7.6 Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing

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