Offset bonded more chip - a semiconductor device

摘要

The present invention has the aim of a lower chip and an upper chip by bumps in a very reliable manner for bonding, wherein a sufficient surface area for an external connection terminal region is ensured because of the upper chip is offset with respect to the lower chip. The substrate 2 has, on a surface bumps 1 and has on its other surface of a first chip 3 is mounted. A second chip 4 is connected to the first chip 3 by bumps 5, 6 bonded, wherein the second chip 4 with respect to the first chip 3 is displaced parallel. In the bonded state of the first chip 3 and of the second chip 4 overlap a part of the first chip 3 and a part of the second chip 4 one another, without their centers are aligned. The center of gravity of the second chip 4 falls into a region in which the outermost bumps between the first chip 3 and the second chip 4 is surrounded.