ROLLED COPPER ALLOY FOIL, AND COPPER CLAD LAMINATE PRODUCED USING THE ROLLED COPPER ALLOY FOIL

摘要

PPROBLEM TO BE SOLVED: To provide a rolled copper alloy foil for use in electronic components such as a flexible printed circuit board (FPC), a tape carrier (TAB) and the electrode of a lithium cell. PSOLUTION: The rolled copper alloy foil has a composition containing one or more kinds selected from Sn, Te and In in an amount of 30 to 100 ppm in total, and, if required, further containing 100 to 500 ppm oxygen, and the balance copper with inevitable impurities. PCOPYRIGHT: (C)2007,JPO&INPIT