THREE-TANK AND ONE-BATH TYPE AUTOMATIC WAFER CLEANING APPARATUS

摘要

PROBLEM TO BE SOLVED: To reduce the footprint of an automatic wafer cleaning apparatus in a batch process for making a wafer more clean and improving its cleaning effect.;SOLUTION: The apparatus as a whole is put under a clean nitrogen gas atmosphere to prevent the occurrence of a natural oxide film. The apparatus uses a minimum required amount of a chemical solution, and has a limited size of a three-tank structure to reduce its footprint as a whole.;COPYRIGHT: (C)2006,JPO&NCIPI