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HEAT-CONDUCTIVE ELECTRICAL INSULATING MEMBER, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING THE HEAT-CONDUCTIVE ELECTRICAL INSULATING MEMBER

机译:导热电绝缘构件,半导体封装以及制造导热电绝缘构件的方法

摘要

PROBLEM TO BE SOLVED: To provide a heat-conductive electrical insulating material usable for a substrate of an electronic part, a radiator or the like, having excellent heat conductivity.;SOLUTION: The material is the heat-conductive electrical insulating material 1 comprising a substrate 2 and an organic-inorganic hybrid layer 3 integrally formed on the surface of the substrate 2. The organic-inorganic hybrid layer 3 comprises an organic-inorganic hybrid formulation obtained by mixing a sol obtained by reacting a metal alkoxide with an organopolysiloxane having functional groups reactive with the metal alkoxide at one terminal or both terminals, with a heat-conductive filler.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种可用于电子部件,散热器等的基板,并且具有优异的导热性的导热电绝缘材料。解决方案:该材料是包括以下材料的导热电绝缘材料1:基板2和一体形成在基板2的表面上的有机-无机杂化层3。有机-无机杂化层3包括通过将通过使金属醇盐与具有官能团的有机聚硅氧烷反应获得的溶胶混合而获得的有机-无机杂化制剂。 (C)2006,JPO&NCIPI,一个或两个末端与金属醇盐具有反应性的基团。

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