High heat dissipation Characteristic package substrate of high brightness LED

摘要

Topic The light condensing effect is had, thermal resistance to be low heat dissipation is quick, at the same time brightness of the light-emitting diode it improves and extends use life, offer of the high heat dissipation Characteristic package substrate of high brightness LED.SolutionsThe package substrate to include the heat dissipation piece, the sinking section to be formed by the surface of the aforementioned heat dissipation piece, the print patchboard which has the transmitted hole which corresponds to the position of the aforementioned sinking section on the aforementioned heat dissipation piece to be jointed, the direct light-emitting diode to be installed on the aforementioned sinking section, between the aforementioned light-emitting diode and the aforementioned print patchboard be jointed electrically by the multiple wires, the among of those and around the sinking section of the aforementioned heat dissipation piece having circular measure, at the same time, the surface of the aforementioned sinking section being overturned when it can provide the optical reflecting layer, because of this, the aforementioned light-emitting diode continues and giving out the illuminant,The aforementioned sinking section it compacts heat abstraction way by the fact that it releases heat the heat which it condenses, at the same time, the aforementioned light-emitting diode consuming electricity, gives out the aforementioned illuminant with the circular measure and the optical reflecting layer, directly the aforementioned heat dissipation piece as a conduction of heat media heat dissipation speed and the effect it features that it improves. Choice figure Drawing 4