VERTICAL TYPE LED CHIP PACKAGE WITH SUPERIOR HEAT DISSIPATION PROPERTIES FOR IMPROVING BRIGHTNESS AND LIFETIME PROPERTIES

摘要

PURPOSE: A vertical type LED chip package with superior heat dissipation properties is provided to additionally install a heat conduction path which is independent to a conductive path between a substrate and an LED chip of the LED chip package, thereby improving heat dissipation properties.;CONSTITUTION: A connection part connects the lower surface of an LED chip and the upper surface of a substrate(4). A conductive path(5a) electrically connects the LED chip and the substrate. The conductive path is manufactured using resin which includes conductive materials. A heat conduction path(5b) transfers heat generated from the LED chip to the substrate. The heat conduction path is manufactured using heat conductive polymer materials.;COPYRIGHT KIPO 2012