Short-wavelength laser dicing apparatus for a diamond wafer and dicing method thereof

摘要

The present invention discloses a short-wavelength laser dicing apparatus for a diamond wafer and a dicing method thereof, wherein a diamond wafer is disposed on a working table; the diamond wafer has multiple scribed lines; a control device is used to position the working table and a short-wavelength laser so that the short-wavelength laser can sequentially cut the scribed lines and the diamond wafer can be separated into multiple discrete chips or dice. The present invention utilizes the high-energy photons of a short-wavelength laser to enable a diamond wafer to be easily cut and can accelerate the cutting process.