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Low profile small outline leadless semiconductor device package
Low profile small outline leadless semiconductor device package
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机译:薄型小尺寸无铅半导体器件封装
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摘要
A molded leadless package encapsulates a small outline integrated circuit or small outline transistor through contact bumps. Electrical contacts extend from the encapsulated device to an exposed surface of the package and are coplanar with that surface and terminate at a junction between said surface at a junction with another of the package surfaces. The contacts terminate only at oppositely disposed surfaces of the package.
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