Flip chip ball grid array package assemblies and electronic devices with heat dissipation capability

摘要

Flip chip ball grid array package assemblies. A chip is disposed on a substrate. A plurality of flip chip balls is connected between the chip and the substrate. A heat spreader is disposed on the chip and includes a first surface and a second surface opposite thereto. The first surface is connected to the chip, and the second surface includes at least one protrusion. A heat sink is connected to the heat spreader and includes at least one recess. The profile of the recess is complementary to that of the protrusion of the heat spreader. The protrusion is positioned in the recess. A plurality of ball grid array electrodes is disposed under the substrate.