Electronic device comprising an electronic die, a substrate integrated waveguide (SIW) and a flip-chip ball grid array package

摘要

An electronic device comprises an electronic die 110 such as a power amplifier mounted via conductive bumps 114, 114', 114" on a dielectric substrate 112, and a waveguide 111 integrated in the dielectric substrate 112. It comprises a conductive projection 120 extending in the substrate integrated waveguide 111 and electrically connected to the electronic die 110 through at least one conductive bump 114'. The conductive projection may be a blind metalized hole extending into the dielectric of the substrate. In addition, the electronic device may have several conductive bumps 114 surrounding the conductive projection which are electrically connected to the top 117 and/or bottom 118 metal plate associated with the substrate integrated waveguide. The substrate integrated waveguide may have at the input end 120 the conductive projection 120 and at the other end an antenna lens 113. The electronic device may be used to provide a low-loss transition between the electrical output of a power amplifier and the electromagnetic field associated with the microwave antenna lens 113. The device may typically operate in the 50-70GHz region.