首页> 外国专利> Plasma immersion ion implantation process using a capacitively coupled plasma source having low dissociation and low minimum plasma voltage

Plasma immersion ion implantation process using a capacitively coupled plasma source having low dissociation and low minimum plasma voltage

机译:使用具有低离解和低最小等离子体电压的电容耦合等离子体源进行等离子体浸没离子注入工艺

摘要

A method for implanting ions in a surface layer of a workpiece includes placing the workpiece on a workpiece support in a chamber with the surface layer being in facing relationship with a ceiling of the chamber, thereby defining a processing zone between the workpiece and the ceiling, and introducing into the chamber a process gas including the species to be implanted in the surface layer of the workpiece. The method includes generating from the process gas a plasma by capacitively coupling RF source power across the workpiece support and the ceiling or the sidewall from an RF source power generator. The method further includes applying an RF bias from an RF bias generator to the workpiece support.
机译:一种将离子注入工件表面层的方法,该方法包括将工件放置在腔室内的工件支撑物上,并使表面层与腔室的顶面相对,从而在工件和顶面之间定义处理区域,将包括要注入到工件表面层中的物质的处理气体引入腔室。该方法包括通过电容性地耦合跨RF射频源功率发生器在工件支架和顶板或侧壁上的射频源功率,从处理气体中产生等离子体。该方法还包括将来自RF偏置发生器的RF偏置施加到工件支架。

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