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Method and system for determining the best integral process path to process semiconductor products to improve yield

机译:确定最佳工艺流程以加工半导体产品以提高产量的方法和系统

摘要

A computer-implemented method for identifying the best process path in a semiconductor manufacturing process for processing a plurality of wafer lots that includes providing a plurality of operations in the semiconductor manufacturing process, providing a plurality of tools in at least one of the plurality of operations, providing a plurality of yields for each of the plurality of operations, providing a plurality of process paths, calculating an average yield for the plurality of yields, setting the average yield as a response, setting the plurality of operations as control factors, setting the plurality of tools as factor levels in response to at least one of the plurality of operations, determining at least one of the plurality of operations as having the most contribution using an analysis of variance method, wherein the at least one of the plurality of operations causes the responses to change greater than a predetermined level when the plurality of tools are changed, and outputting the at least one of the plurality of operations as the most influential operation.
机译:一种用于在用于加工多个晶片的半导体制造工艺中识别最佳工艺路径的计算机实现的方法,该方法包括在半导体制造工艺中提供多个操作,在多个操作中的至少一个中提供多个工具,为多个操作中的每个操作提供多个产量,提供多个处理路径,计算多个产量的平均产量,将平均产量设置为响应,将多个操作设置为控制因素,响应于多个操作中的至少一个,将多个工具作为因子水平,使用方差分析方法将多个操作中的至少一个确定为贡献最大,其中,多个操作中的至少一个导致当多个工具被改变时,改变的响应大于预定水平,并且输出将多个操作中的至少一个作为最有影响力的操作。

著录项

  • 公开/公告号US6975916B2

    专利类型

  • 公开/公告日2005-12-13

    原文格式PDF

  • 申请/专利权人 NEAL KUO;

    申请/专利号US20010900165

  • 发明设计人 NEAL KUO;

    申请日2001-07-09

  • 分类号G06F19/00;

  • 国家 US

  • 入库时间 2022-08-21 21:41:28

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