LIGHT-EMITTING DIODE PACKAGE USING HIGH THERMAL CONDUCTIVE REFLECTOR AND MANUFACTURING METHOD OF THE SAME

摘要

The present invention relates to a light emitting diode package using the high thermal conductive reflector to quickly dissipate heat generated during light emission of the LED chip to improve the structure and material of the reflector for reflecting light upon light emission of the LED chip mounted on the LED package by also and with changing the conductive high-temperature material of the reflector and the housing containing the heat-dissipating wings so as to be exposed to the outside of the housing to form a heat radiation wing on one side of the reflector is provided for reflecting the light of the LED chip, the heat of the LED chip quickly it is possible to heat radiation to the outside is improved in the LED chips life, and a peripheral circuit to prevent the thermal damage received by the high temperature, safety is an LED package and a manufacturing method using a high thermal conductive reflector it can improve the It aims to provide. A light emitting diode with high heat conductivity reflector according to the present invention for achieving the above objects, packages and a main body portion comprising an LED chip mounted on a substrate circuit lead frames or printed, said body portion surrounding the housing and a central penetrating formed and coupled to the upper side of the main body is formed at a side of the reflector, and the reflector sealed by the housing comprises a heat-dissipating wings projecting outwardly of the housing.