LIGHT-EMITTING DIODE PACKAGE USING HIGH THERMAL CONDUCTIVE REFLECTOR AND MANUFACTURING METHOD OF THE SAME

摘要

The present invention is the structure of the reflector for reflecting the emission light when the LED chip mounted in the LED package, and as by improving the materials of the LED package with a high thermal conductivity of the reflector quickly dissipate heat generated during light emission of the LED chip, the light outside the housing of the LED chips to form the wings at one side of the heat reflector is provided for reflecting the material of the reflector and the housing containing the heat box with wings so as to be exposed to high thermal conductivity by changing the LED chip to the heat radiation to the exterior can be quickly and increase the life of the LED chip, around the high temperature circuit prevent thermal damage to, and received by, and to provide an LED package and a manufacturing method using the reflector with a high thermal conductivity for the purpose of improving safety can be achieved. The body portion and the LED package with a high thermal conductivity reflector according to the present invention, including an LED chip mounted on a lead frame or a printed circuit board to achieve the above object, the main body portion surrounding the housing and a central through- It is formed and bonded to the upper side of the main body portion and the sealing of the reflector by the housing, is formed at a side of the reflector and a heat dissipating wings projecting outwardly of the housing.