WAFER SUPPORTING METHOD AND WAFER HOLDER FOR HIGH-TEMPERATURE SEMICONDUCTOR-MANUFACTURE-LINE

摘要

In the present invention, in the large-diameter wafer in a semiconductor manufacturing apparatus for high temperature treatment process, forming a fluid at high temperature process and by having a combined silicon carbide quartz and high temperature in the process is forming a support holder, that suppress the slip of the semiconductor manufacturing equipment and wafer holder for wafer support method in which a high temperature process for semiconductor manufacturing processes and improve productivity of hot process equipment is disclosed. ; The invention in fluid contact with the quartz as it changes in a high temperature process in that the upper line of the holder of a ceramic body 10, the support 12 to maintain the rigidity at a high temperature for this process body 14 and having a bottom portion contacting the wafer with a support point of the contact body of silicon carbide with a quartz wafer 100 at the contact position of the wafer by a high temperature process in addition to the flow of the high temperature also avoids the direct contact of the The method provides a wafer support and the holder for the semiconductor manufacturing process to maintain a high temperature process. ; Here, the wafer support member is a physical property of the contact with the heat of the high temperature zone of the flow changes in the process to heat contact body includes a supporting section and a fluid, shape euroneun by providing contact body 12 with the ring-like contact support, and characterized by a concentric circle in its support position, the wafer due to the contact body 12, as another embodiment of the quartz 100, the support is characterized by performing a three-point support or four point support radially concentric according to the support position.