BONDING HEAD AND FLIP CHIP BONDER HAVING THE SAME

摘要

SUMMARY OF THE INVENTION An object of the present invention is to obtain a high productivity and bonding reliability by applying a laser crimping method, and a flip chip bonding head for flip chip bonding capable of performing a flip chip bonding process for semiconductor chips of various sizes and flip chip bonding having the same. To provide a device. To this end, in the present invention, there is provided a suction means for the semiconductor chip and a heating means for the semiconductor chip, wherein the heating means for the semiconductor chip comprises: a laser light source; A lens assembly for irradiating light emitted from the laser light source to the semiconductor chip to heat the temperature of the semiconductor chip to a junction temperature, and to adjust a beam width of the laser beam so that the laser beam is evenly irradiated onto the front surface of the semiconductor chip; And a bonding head including an optical fiber forming an optical path of a laser beam from the laser light source to the lens assembly, and a flip chip bonding apparatus having the same.