Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit

摘要

Integrated circuit (14) is mounted upside down on carrier (10), such that connection element (15) contacts with insulator (17), through the hole of carrier. Patterned rewriting elements (18, 19) attached in insulator, are internally connected by patterned solder resist element (20). Solder balls (22) are attached in area that is uncovered by resist element, of rewriting element, in patterned form. An Independent claim is also included for integrated circuit.