Investigation, research and manufacture of SOI structures to produce integrated circuits and different devices of microelectronics

摘要

In the future special microelectronics solutions will allow the developing of separate segments of commercial electronics on the world level. As a result of research the manufacturing route is developed and samples of SOI structures are obtained by the method of bonding and gas splitting. Silicon wafer surfaces and instrument layers obtained by methods of bonding are investigated. The results of sample characteristics research allow the availability of the chosen technological process of the wafer clearing process in manufacturing of SOI structures and expediency of similar manufacture at microelectronics enterprises.