首页> 外国专利> Silicon optoelectronic device manufacturing method and Silicon optoelectronic device manufactured by thereof and Image input and/or output apparatus applied it

Silicon optoelectronic device manufacturing method and Silicon optoelectronic device manufactured by thereof and Image input and/or output apparatus applied it

机译:硅光电器件的制造方法,由其制造的硅光电器件以及应用了该器件的图像输入和/或输出装置

摘要

Provided are a method of manufacturing a silicon optoelectronic device, a silicon optoelectronic device manufactured by the method, and an image input and/or output apparatus having the silicon optoelectronic device. The method includes: preparing an n-type or p-type silicon-based substrate (1); forming a polysilicon in one or more regions of the surface of the substrate (15,25,35); oxidizing the surface of the substrate where the polysilicon is formed, to form a silicon oxidation layer on the substrate, and forming a microdefect flection pattern (51,55) at the interface between the substrate and the silicon oxidation layer, wherein the microdefect flection pattern is formed by the oxidation accelerated by oxygen traveling through boundaries of the grains in the polysilicon; exposing the microdefect flection pattern by etching the silicon oxidation layer; and forming a doping region by doping the exposed microdefect flection pattern with a dopant of the opposite type to the substrate.
机译:提供了一种制造硅光电器件的方法,通过该方法制造的硅光电器件以及具有该硅光电器件的图像输入和/或输出设备。该方法包括:准备n型或p型硅基衬底(1);在衬底表面的一个或多个区域中形成多晶硅(15、25、35);氧化形成多晶硅的衬底的表面,以在衬底上形成硅氧化层,并在衬底和硅氧化层之间的界面处形成微缺陷弯曲图案(51,55),其中,微缺陷弯曲图案它是由氧气穿过多晶硅中晶界而加速氧化而形成的。通过蚀刻硅氧化层暴露微缺陷弯曲图案;通过用与衬底相反类型的掺杂剂掺杂暴露的微缺陷弯曲图案来形成掺杂区域。

著录项

  • 公开/公告号KR100612875B1

    专利类型

  • 公开/公告日2006-08-14

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20040097007

  • 发明设计人 송인재;최병룡;

    申请日2004-11-24

  • 分类号H01L33;

  • 国家 KR

  • 入库时间 2022-08-21 21:23:11

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