An apparatus (1) for wet cleaning or etching of flat substrates (9) comprising a tank (3) with an inlet opening (5) and outlet opening (7) for said substrates. Said tank contains a cleaning liquid (11) and is installed in a gaseous environment (13). At least one of the openings is a slice in a sidewall of the tank and is present below the liquid-surface (15). In the tank (3) there may be a portion (25) above the liquid (11) filled with a gas with a pressure being lower than the pressure within said environment (13).;The method comprises the step of transferring a substrate through the cleaning or etching liquid at a level underneath the surface of said liquid making use of said apparatus.
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