Semiconductor device for e.g. credit card, has passivation edge protection covering edge part on chip surface, where edge part is not occupied by integrated circuit and extends between integrated circuit and outer edge of chip

摘要

The device has a semiconductor chip (1) including an integrated circuit (1a) that is electrically connected to a contact unit (3) and a passivation layer (4) that covers the integrated circuit and through which the contact unit passes. A passivation edge protection (5) covers an edge part (6) on a chip surface. The edge part is not occupied by the integrated circuit and extends between the integrated circuit and an outer edge of the chip. An independent claim is also included for a method for producing a semiconductor device.