METHOD FOR PRODUCING ULTRATHIN COPPER FOIL WITH CARRIER, ULTRATHIN COPPER FOIL PRODUCED BY THE PRODUCTION METHOD, AND PRINTED CIRCUIT BOARD, MULTILAYER PRINTED CIRCUIT BOARD AND WIRING BOARD FOR CHIP ON FILM USING THE ULTRATHIN COPPER FOIL

摘要

PROBLEM TO BE SOLVED: To provide an ultrathin copper foil of ≤5 μm with a carrier in which the number of pinholes is small, and also, surface roughness is reduced; to provide its production method; and to provide a printed circuit board, a multilayer printed circuit board and a wiring board for a chip on film for fine pattern applications using the ultrathin copper foil with a carrier.;SOLUTION: Regarding the method for producing an ultrathin copper foil with a carrier, at least one side of a copper foil is subjected to mechanical polishing treatment. The polished face in the polished foil is subjected to electrochemical treatment so as to make its surface into a smoothed face of 0.01 to 2.0 μm by Rz, and the smoothed face in the carrier copper foil is stacked with a release layer and an ultrathin copper foil in order.;COPYRIGHT: (C)2007,JPO&INPIT