Thermomigration vessel structure, the integrated circuit, the method of forming thermomigration vessel structure, and the method of forming the integrated circuit

摘要

Heat it receives this invention and, inserts and around surrounding the territory, it includes the thermomigration vessel which has the base which possesses the surface. The frame part only connection has opening where it crosses the thickness of the frame on the peripheral surface. Heat it receives this invention and, inserts and around surrounding the surface, it includes the method of forming thermomigration vessel structure by forming the based part which possesses the territory. The independent frame part is connected to the based part. This invention includes the calorification equipment and the integrated circuit which possesses the thermomigration vessel structure of heat transfer possible state. Heat it receives the thermomigration vessel and, inserts and the surface and around connecting to the frame part, it has the base which possesses with the surface. This invention includes the technique which forms the integrated circuit which includes the fact that the multi part thermomigration vessels are provided thing, and the calorification equipment and heat transfer possible when the integrated circuit board which possesses the calorification equipment which is installed is provided.