GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH JUNCTION RELIABILITY, HIGH CIRCULARITY OF COMPRESSION BONDING BALL, HIGH LINEARITY AND HIGH RESIN FLOW RESISTANCE

摘要

PROBLEM TO BE SOLVED: To provide a gold alloy wire for a bonding wire having high junction reliability, the high circularity of a compression bonding ball, high linearity and high resin flow resistance.;SOLUTION: The gold alloy wire for the bonding wire contains one or two kinds of Pt and Pd of 5,000 ppm-2 mass% in total, Ir of 1-200 ppm, Ca of 20-200 ppm, and Eu of 10-200 ppm, contains Be of 0.1-30 ppm as necessary, contains La of 10-200 ppm as necessary, and contains two or more kinds selected from Ca, Eu, Be and La of a range of 50- 250 ppm in total.;COPYRIGHT: (C)2007,JPO&INPIT