GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL JUNCTION PROPERTY, HIGH JUNCTION RELIABILITY, HIGH CIRCULARITY OF COMPRESSION BONDING BALL, HIGH LINEARITY, HIGH RESIN FLOW RESISTANCE AND LOW SPECIFIC RESISTANCE

摘要

PPROBLEM TO BE SOLVED: To provide a gold alloy wire for a bonding wire having high initial junction property, high junction reliability, the high circularity of a compression bonding ball, high linearity, high resin flow resistance and specific resistance. PSOLUTION: The gold alloy wire for the bonding wire contains one or two kinds of Pt and Pd of lower than 500-1,000 ppm in total, Ir of 1-100 ppm, Ca of more than 30-100 ppm, and Eu of more than 30-100 ppm, contains Be of 0.1-20 ppm as necessary, contains one or more kinds selected from La, Ba, Sr and Bi of 30-100 ppm in total as necessary, contains Ag of 1-10 ppm as necessary, and has the balance of component composition comprising Au and inevitable impurities. PCOPYRIGHT: (C)2007,JPO&INPIT