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Novel structure/method to fabricate a high-performance magnetic tunneling junction MRAM

机译:新型结构/方法可制造高性能磁隧道结MRAM

摘要

An MTJ (magnetic tunneling junction) MRAM (magnetic random access memory) cell is formed on a conducting lead and magnetic keeper layer that is capped by a sputter-etched Ta layer. The Ta capping layer has a smooth surface as a result of the sputter-etching and that smooth surface promotes the subsequent formation of a lower electrode (pinning/pinned layer) with smooth, flat layers and a radical oxidized (ROX) Al tunneling barrier layer which is ultra-thin, smooth, and to has a high breakdown voltage. A seed layer of NiCr is formed on the sputter-etched capping layer of Ta. The resulting device has generally improved performance characteristics in terms of its switching characteristics, GMR ratio and junction resistance.
机译:在被溅射蚀刻的Ta层覆盖的导电引线和磁性保持层上形成MTJ(磁性隧道结)MRAM(磁性随机存取存储器)单元。 Ta覆盖层由于溅射蚀刻而具有光滑的表面,并且该光滑的表面促进了随后形成具有光滑,平坦层和自由基氧化(ROX)Al隧穿势垒层的下部电极(固定/固定层)超薄,光滑,击穿电压高。 NiTa的籽晶层形成在Ta的溅射蚀刻的覆盖层上。所得器件在开关特性,GMR比和结电阻方面通常具有改善的性能特性。

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