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High-performance MRAM technology with an improved magnetic tunnel junction material

机译:高性能MRAM技术和改进的磁隧道结材料

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This work is a report on high-performance MRAM technology. 0.4/spl times/0.8 /spl mu/m/sup 2/ MTJ elements were successfully integrated with 0.35 /spl mu/m CMOS technology without process-induced damage. A magnetoresistance (MR) ratio of more than 55% and the read/write operating point were obtained by introducing an improved magnetic tunnel junction (MTJ) material. The short-pulse writing in combination with an improved cell structure suggests that MRAM has a great deal of potential for low power applications.
机译:这项工作是有关高性能MRAM技术的报告。 0.4 / spl次/0.8/spl mu / m / sup 2 / MTJ元件已成功地与0.35 / spl mu / m CMOS技术集成在一起,而不会引起工艺损伤。通过引入改进的磁隧道结(MTJ)材料,可获得超过55%的磁阻(MR)比和读/写工作点。短脉冲写入与改进的单元结构相结合,表明MRAM在低功耗应用中具有很大的潜力。

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