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Process for manufacturing a phase change memory array in Cu-damascene technology and phase change memory array thereby manufactured

机译:以铜镶嵌技术制造相变存储器阵列的方法和由此制造的相变存储器阵列

摘要

A process for manufacturing a phase change memory array includes the steps of: forming a plurality of phase change memory cells in an array region of a semiconductor wafer, the phase change memory cells arranged in rows and columns according to a row direction and to a column direction, respectively; forming a control circuit in a control region of the semiconductor wafer; forming a plurality of first bit line portions for mutually connecting phase change memory cells arranged on a same column; forming first level electrical interconnection structures; and forming second level electrical interconnection structures above the first level electrical interconnection structures. The first level electrical interconnection structures include second bit line portions laying on and in contact with the first bit line portions and projecting from the first bit line portions in the column direction for connecting the first bit line portions to the control circuit.
机译:制造相变存储器阵列的方法包括以下步骤:在半导体晶片的阵列区域中形成多个相变存储器单元,相变存储器单元根据行方向和列以行和列布置方向在半导体晶片的控制区域中形成控制电路;形成用于相互连接布置在同一列上的相变存储单元的多个第一位线部分;形成第一级电互连结构;在所述第一级电互连结构上方形成第二级电互连结构。第一级电互连结构包括第二位线部分,该第二位线部分放置在第一位线部分上并与第一位线部分接触并从第一位线部分沿列方向突出,用于将第一位线部分连接至控制电路。

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