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Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits
Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits
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机译:在集成电路中底层有源器件,无源器件和/或介电层上制造引线键合焊盘
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摘要
A wire connection structure for an integrated circuit (IC) die includes a semiconductor wafer with an active device and/or a passive device. One or more dielectric layers are arranged adjacent to the active and/or passive device. One or more metal interconnect layers are arranged adjacent to the active and/or passive device. A contact pad is arranged in an outermost metal interconnect layer. A passivation layer is arranged over the outermost metal interconnect layer and includes at least one passivation opening that exposes the contact pad. A bond pad is arranged over the passivation layer and the active and/or passive device and is connected to the contact pad through the passivation opening. Formation of the bond pad does not damage the active and/or passive device.
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