Method for manufacturing thin-film multilayer electronic component and thin-film multilayer electronic component

摘要

In a method for manufacturing a thin-film multilayer electronic component, dielectric thin films and thin-film internal electrodes are alternately layered on each other to form a laminate. The thin-film internal electrodes are alternately displaced in a predetermined direction to form an overlap portion. The entire thickness of the laminate and a portion of the thickness of the substrate are cut to form grooves in portions other than the overlap portion, in a direction that is substantially perpendicular to the predetermined direction. External electrodes are formed on at least the cut surfaces of the laminate and the half-cut surfaces of the substrate. Then, the substrate is fully cut in the thickness direction along the grooves such as not to substantially remove the external electrodes.