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PENDEOEPITAXIAL GROWTH OF GALLIUM NITRIDE LAYERS ON SAPPHIRE SUBSTRATES

机译:蓝宝石基体上氮化镓层的前外延生长

摘要

Gallium nitride semiconductor layers may be fabricated by etching anunderlying gallium nitride layer (104) on asapphire substrate (102a), to define at least one post (106) in the underlyinggallium nitride layer and at least one trench (107) in theunderlying gallium nitride layer. The at least one post includes a galliumnitride top and a gallium nitride sidewall (105). The at leastone trench includes a trench floor. The gallium nitride sidewalls arelaterally grown into the at least one trench, to thereby form agallium nitride semiconductor layer. In a preferred embodiment, the at leastone trench extends into the sapphire substrate such thatthe at least one post further includes a sapphire sidewall an a sapphirefloor. A mask (201) may be included on the sapphire floorand an alluminum nitride buffer layer (102b) also may be included between thesapphire substrate and the underlying gallium nitridelayer. A mask (209) also may be included on the gallium nitride top. The maskon the floor and the mask on the top preferablycomprise same material.
机译:可以通过蚀刻氮化镓半导体层来制造氮化镓半导体层。衬底上的下面的氮化镓层(104)蓝宝石衬底(102a),以在下面形成至少一个柱(106)氮化镓层和至少一个沟槽(107)下层氮化镓层。至少一个柱包括镓氮化物顶部和氮化镓侧壁(105)。至少一个沟槽包括沟槽底部。氮化镓侧壁是横向生长到至少一个沟槽中,从而形成一个氮化镓半导体层。在一个优选的实施方案中,至少一个沟槽延伸到蓝宝石衬底中,使得至少一个柱还包括蓝宝石侧壁和蓝宝石地板。蓝宝石地板上可包括面罩(201)氮化铝缓冲层(102b)也可以包括在蓝宝石衬底和下面的氮化镓层。掩模(209)也可以包括在氮化镓顶部上。面具最好放在地板上,最好放在上面的面具包含相同的材料。

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