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DIELECTRIC FILM AND METHOD OF FORMING IT, SEMICONDUCTOR DEVICE, NONVOLATILE SEMICONDUCTOR MEMORY DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

机译:介电膜及其形成方法,半导体器件,非易失性半导体存储器件以及半导体器件的生产方法

摘要

In a film formation method of a semiconductor device including a plurality of silicon-based transistors or capacitors, there exist hydrogen at least in a part of the silicon surface in advance, and the film formation method removes the hydrogen by exposing the silicon surface to a first inert gas plasma. Thereafter a silicon compound,layer is formed on the surface of the silicon gas by generating plasma while using a mixed gas of a second inert gas and one or more gaseous molecules, such that there is formed a silicon compound layer containing at least a pat of the elements constituting the gaseous molecules, on the surface of the silicon gas. IMAGE
机译:在包括多个硅基晶体管或电容器的半导体器件的膜形成方法中,预先至少在硅表面的一部分中存在氢,并且该膜形成方法通过将硅表面暴露于硅中而去除氢。第一惰性气体等离子体。此后,通过使用第二惰性气体和一种或多种气态分子的混合气体产生等离子体,在硅气的表面上形成硅化合物层,从而形成至少包含一氧化碳的硅化合物层。在硅气表面上构成气态分子的元素。 <图像>

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