Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces

摘要

Electrochemical of the microelectronic workpiece and mechanical processing method and the apparatus are disclosed. One embodiment is a microelectronic workpiece and the workpiece holder 120 configured to receive (110), the work piece electrode 130, a first remote electrode (142a) of the electrochemical processing device 100 according to the present invention , and the second having a remote electrode (142b). The work piece is electrode 142 is configured so that when the workpiece is accommodated in the workpiece holder 120 in contact with the processing surface 113 of the workpiece 110. The first and the second remote electrode 142 is at a predetermined spacing from the workpiece holder 120. The device 100 also may include an AC power supply source (174), DC power supply 172, and a switching assembly (180). The switching assembly 180 is connected to the work piece electrode 130, a first remote electrode (142a) and a second remote electrode (142b) and the AC power supply 174, and DC power supply source (172) . In operation, the switching assembly 180, and the plating material, deployment rating (deplating) and / or to remove mechanically AC power source 174 and / or a DC power source 172, the work piece electrode 130 so as to connect the first remote electrode (142a) and / or the second remote electrode (142b). ; The microelectronic workpiece, the electrochemical processing device, the workpiece holder, the workpiece electrode, power supply, remote switching electrode assembly