Semiconductor chip mounting apparatus e.g. die bonder, has sensor with two isolated coils which detects structure of substrate, to decide passage of substrate between transport systems

摘要

The substrate from a loading station is distributed to the two transport systems. The primary transport system removes each substrate orderly and passes the substrate onto secondary transport system. The secondary system transports substrate in steps to a dispensing station and bonding station. A sensor with two isolated coils, detects the structure of substrate based on which the substrate passage to the secondary system is decided.