Die bonder for mounting semiconductor chips on substrate, has slide magnetically coupled to drive in drive system, to push substrates against end stop so as to align substrates parallel to end stop

摘要

A pusher device includes a slide magnetically coupled to drive using ferromagnetic magnets in a drive system. the slide pushes substrates (2) placed for processing on a support surface of a receiving table, against the end stop so as to align substrates parallel to end stop. A controller (30) sets starting position and traveling distance of drive system moving the slide, using a software running on the controller.