首页> 外国专利> METHOD FOR FORMING BISMUTH-LAYER-LIKE FERRODIELECTRIC FILM, SEMICONDUCTOR DEVICE HAVING THE BISMUTH-LAYER-LIKE FERRODIELECTRIC FILM, AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR DEVICE

METHOD FOR FORMING BISMUTH-LAYER-LIKE FERRODIELECTRIC FILM, SEMICONDUCTOR DEVICE HAVING THE BISMUTH-LAYER-LIKE FERRODIELECTRIC FILM, AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR DEVICE

机译:形成类似铋层的铁电薄膜的方法,具有类似铋层的铁电薄膜的半导体装置以及该半导体装置的制造方法

摘要

PROBLEM TO BE SOLVED: To selectively form a bismuth-layer-like ferrodielectric film on a lower electrode by avoiding an insulating film.;SOLUTION: A method for forming the bismuth-layer-like ferrodielectric film includes a step (a) of forming a polycrystalline conductive film 110 in an amorphous insulating film 181, formed on a board 100 so as to expose a part of the polycrystalline conductive film 110, and a step (b) of selectively forming the bismuth-layer-like ferrodielectric film 111 on the exposed portion of the polycrystalline conductive film 110. At the step (b), the formation of an oxide film, containing a constituent element of the bismuth-layer-like ferrodielectric film 111 on the amorphous insulating film 181, is prevented.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:通过避免绝缘膜在下部电极上选择性地形成铋层状铁电介质膜;解决方案:形成铋层状铁电介质膜的方法包括步骤(a):在基板100上形成以暴露多晶导电膜110的一部分的非晶绝缘膜181中的多晶导电膜110,以及在所暴露的表面上选择性地形成铋层状铁电介质膜111的步骤(b)在步骤(b)中,防止在非晶绝缘膜181上形成包含铋层状铁电介质膜111的构成元素的氧化膜。 C)2008,日本特许厅

著录项

  • 公开/公告号JP2008211005A

    专利类型

  • 公开/公告日2008-09-11

    原文格式PDF

  • 申请/专利权人 MATSUSHITA ELECTRIC IND CO LTD;

    申请/专利号JP20070046602

  • 发明设计人 ISOGAI KAZUNORI;

    申请日2007-02-27

  • 分类号H01L21/8246;H01L27/105;H01L21/316;

  • 国家 JP

  • 入库时间 2022-08-21 20:25:58

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