ELECTRONIC COMPONENT MODULE AND CIRCUIT BOARD WITH BUILT-IN COMPONENTS INCORPORATING THE MODULE

摘要

PROBLEM TO BE SOLVED: To incorporate an electronic component with a terminal, having an ultrafine pitch of 200 μm or smaller, and to prevent damages due to thermal stress at reflow process, in the electronic component of an electronic component module incorporated in a circuit board.;SOLUTION: Singular or a plurality of electronic components 14 are mounted on a first resin layer 11. A second resin layer 12 made of a material, having low elastic modulus and low thermal expansion coefficient on the first resin layer 11 so as to surround a periphery of the electronic component 14 and not to cover a surface of a terminal electrode 14a of the electronic component 14. A photosensitive third resin layer 13 covers the second resin layer 12 and the electronic component 14; a via hole 13a is formed in the third resin layer 13 by photolithographic method; and an electrode pad 15 led out from the terminal electrode 14a of the electronic component via the via hole is provided on the third resin layer 13.;COPYRIGHT: (C)2008,JPO&INPIT