首页> 外国专利> CIRCUIT BOARD WITH BUILT-IN ELECTRONIC COMPONENT, ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING CIRCUIT BOARD WITH BUILT-IN ELECTRONIC COMPONENT

CIRCUIT BOARD WITH BUILT-IN ELECTRONIC COMPONENT, ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING CIRCUIT BOARD WITH BUILT-IN ELECTRONIC COMPONENT

机译:具有内置电子组件的电路板,电子模块,电子设备以及具有内置电子组件的电路板的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a circuit board with built-in electronic component having higher heat resistance property and assuring excellent connection strength of an electronic component and an inner layer board.;SOLUTION: In the circuit board with built-in electronic component where an electronic component 35 is embedded within a printed circuit board, the front surface of connecting terminal, formed on the front surface of the inner layer board on which an electronic component 35 is mounted, is partially roughened and is partially covered with a material 33 selected from silver or tin. Moreover, the surface of a lead-wire led from the connecting terminal is partially roughened and an insulator is formed and an electronic component is embedded therein without via a solder resist to the front surface of the inner layer board.;COPYRIGHT: (C)2008,JPO&INPIT
机译:要解决的问题:提供一种电路板,其内置电子部件具有较高的耐热性,并确保电子部件与内层板的优良连接强度。;解决方案:在具有电子部件的电路板中,电子部件35嵌入印刷电路板内,连接端子的前表面形成在安装有电子部件35的内层板的前表面上,该前表面被部分地粗糙化并且部分地被选择的材料33覆盖。从银或锡。而且,从连接端子引出的引线的表面被部分地粗糙化,并且形成绝缘体,并且在不经由阻焊剂的情况下将电子部件嵌入到内层板的前表面中。;版权所有:(C) 2008,日本特许厅

著录项

  • 公开/公告号JP2008198712A

    专利类型

  • 公开/公告日2008-08-28

    原文格式PDF

  • 申请/专利权人 TOPPAN PRINTING CO LTD;

    申请/专利号JP20070030475

  • 发明设计人 FURUYA AKIHIKO;SHIMA SHINYA;

    申请日2007-02-09

  • 分类号H05K3/34;H05K3/46;H05K3/38;H01L23/12;

  • 国家 JP

  • 入库时间 2022-08-21 20:24:17

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