BOARD BUILT-IN MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR, PRINTED CIRCUIT BOARD INCLUDING BOARD BUILT-IN MULTILAYER CERAMIC ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a board built-in multilayer ceramic electronic component having enhanced adhesive characteristics for improving the peeling phenomenon between the multilayer ceramic electronic component and a board, and to provide a manufacturing method therefor, and a printed circuit board including the board built-in multilayer ceramic electronic component.SOLUTION: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer, first internal electrode and second internal electrode arranged to face each other while sandwiching the dielectric layer, a first external electrode formed on the outside of the ceramic body and connected electrically with the first internal electrode and a second external electrode connected electrically with the second internal electrode, and a plating layer formed on the first and second external electrodes. The ceramic body has a surface roughness of 500 nm or more, and less than the thickness of the ceramic cover sheet, and the plating layer has a surface roughness of 300 nm or more, and less than the thickness of the plating layer.