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Special Articles: Assembly Technology Trends of Smallest, Thinnest and Lightest Electronic Equipment by Thin Multilayer Boards. Canon Camcorder with High Density Printed Circuit Board.

机译：特殊文章：薄多层板装配技术最小，最薄，最轻和最轻的电子设备。佳能摄像机与高密度印刷电路板。

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Motoo KUMAGAI;
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年度 1995
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1. Trends in CVD Technology and Equipment for Obtaining Thin Insulating SiO2-Based Films in Microelectronics. Part 1: Materials, Deposition Methods, and Equipment [J] . V. Yu. Vasllev Russian Microelectronics . 1999,第3期

机译：在微电子学中获得薄绝缘SiO2基薄膜的CVD技术和设备的趋势。第1部分：材料，沉积方法和设备
2. Multilayer thin-film technology enabling technology for solving high-density interconnect and assembly problems [J] . Eric Beyne Nuclear Instruments & Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment . 2003,第1a3期

机译：多层薄膜技术使技术能够解决高密度互连和组装问题
3. Trends in CVD Technology and Equipment for Obtaining Thin Insulating SiO2-Based Films in Microelectronics. Part 2: Narrow Gap Fill [J] . V. Yu. VaSilev Russian Microelectronics . 1999,第3期

机译：在微电子学中获得薄绝缘SiO2基薄膜的CVD技术和设备的趋势。第2部分：窄间隙填充
4. Ultra-Thin Printed Circuit Assembly - A Solution for Light Weight Compact Electronic Products [C] . Dale Lee, Leonard Sherman, Cynthia Tan, Annual Pan Pacific microelectronics symposium . 1999

机译：超薄印刷电路板-轻巧紧凑型电子产品的解决方案
5. Special Articles: Assembly Technology Trends of Smallest, Thinnest and Lightest Electronic Equipment by Thin Multilayer Boards. Packaging Technology for Mobile Computer. [O] . Shohgo IDA, Toshihiko NISHIO 1995

机译：特殊文章：薄多层板装配技术最小，最薄，最轻和最轻的电子设备。移动计算机包装技术。

Special Articles: Assembly Technology Trends of Smallest, Thinnest and Lightest Electronic Equipment by Thin Multilayer Boards. Canon Camcorder with High Density Printed Circuit Board.

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