首页> 外国专利> RESIST UNDERCOAT FILM MATERIAL, AND RESIST UNDERCOAT FILM SUBSTRATE AND PATTERN FORMING METHOD USING THE SAME

RESIST UNDERCOAT FILM MATERIAL, AND RESIST UNDERCOAT FILM SUBSTRATE AND PATTERN FORMING METHOD USING THE SAME

机译:抗蚀剂底膜材料,以及使用相同的抗蚀剂底膜基质和图案形成方法

摘要

PROBLEM TO BE SOLVED: To provide a resist undercoat film material for a multilayer resist process, in particular, the material for a two-layer resist process or a three-layer resist process, which has the function to neutralize an amine-based contaminant from a substrate to reduce adverse effect such as a resist pattern footing on an overcoat resist.;SOLUTION: The resist undercoat film material for forming an undercoat film of a chemically amplifying photoresist layer comprises a crosslinking polymer and a thermal acid generator expressed by general formula (1a):R1CF2SO3-(R2)4N+ which generates an acid by heating at 100°C or higher. A resist undercoat film substrate is provided which has a resist undercoat film formed by using the resist undercoat film material.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:为了提供用于多层抗蚀剂工艺的抗蚀剂底涂膜材料,特别是用于两层抗蚀剂工艺或三层抗蚀剂工艺的材料,其具有中和来自胺的污染物的功能。解决方案:用于形成化学放大光致抗蚀剂层底涂层的抗蚀剂底涂层膜材料包含交联聚合物和由通式( 1a):R 1 CF 2 SO 3 -(R 2 )< Sub> 4 N + 通过在100℃或更高的温度下加热产生酸。提供一种抗蚀剂底涂膜基板,其具有通过使用该抗蚀剂底涂膜材料形成的抗蚀剂底涂膜。版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008039815A

    专利类型

  • 公开/公告日2008-02-21

    原文格式PDF

  • 申请/专利权人 SHIN ETSU CHEM CO LTD;

    申请/专利号JP20060209699

  • 申请日2006-08-01

  • 分类号G03F7/11;G03F7/26;H01L21/027;

  • 国家 JP

  • 入库时间 2022-08-21 20:22:41

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号