首页> 外国专利> MULTILAYER CERAMIC COLLECTIVE BOARD, MULTILAYER CERAMIC BOARD, AND MANUFACTURING METHOD FOR MULTILAYER CERAMIC COLLECTIVE BOARD

MULTILAYER CERAMIC COLLECTIVE BOARD, MULTILAYER CERAMIC BOARD, AND MANUFACTURING METHOD FOR MULTILAYER CERAMIC COLLECTIVE BOARD

机译:多层陶瓷集合体板,多层陶瓷集合体以及多层陶瓷集合体的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a multilayer ceramic collective board or the like reducing the infiltration of a liquid at the lower end section of a split trench and having an excellent reliability in the multilayer ceramic collective board by a nonshrinking process.;SOLUTION: In the multilayer ceramic collective board, the split trenches in the longitudinal and horizontal directions are formed to both surfaces or one surface of a non-sintered multilayer ceramic body laminating a green sheet for the board consisting of a low-temperature sintering material containing ceramics. In the multilayer ceramic collective board, a laminate is formed by forming a constraining layer mainly comprising inorganic particles not sintered even at the sintering temperature of the non-sintered multilayer ceramic body so as to be stuck on both surfaces or one surface of the non-sintered multilayer ceramic body. In the multilayer ceramic collective board, the laminate is sintered at a temperature sintering the non-sintered multilayer ceramic body and the constraining layer is removed. In such a multilayer ceramic collective board, an inhibiting region inhibiting extension to the lower section of the split trench is formed in the lower section of at least one split trench.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种多层陶瓷集合板等,其减少液体在裂沟的下端部的渗透,并且通过非收缩工艺在多层陶瓷集合板中具有优异的可靠性。在该多层陶瓷集合体基板上,在层叠有包含陶瓷的低温烧结材料的基板用生片的未烧结多层陶瓷体的两面或一个面上形成有沿长度方向和水平方向的分割沟槽。在多层陶瓷集合基板中,通过形成约束层形成层压板,该约束层主要包括即使在未烧结多层陶瓷体的烧结温度下也未烧结的无机颗粒,从而粘附在非烧结陶瓷的两个表面或一个表面上。烧结多层陶瓷体。在多层陶瓷集合板中,在烧结未烧结的多层陶瓷体的温度下烧结层压体,并去除约束层。在这样的多层陶瓷集合基板中,在至少一个分割槽的下部形成有抑制向分割槽的下部延伸的抑制区域。版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008124108A

    专利类型

  • 公开/公告日2008-05-29

    原文格式PDF

  • 申请/专利权人 HITACHI METALS LTD;

    申请/专利号JP20060303666

  • 发明设计人 UEDA ITARU;

    申请日2006-11-09

  • 分类号H05K3/46;H05K1/02;H05K3/00;H01L23/13;

  • 国家 JP

  • 入库时间 2022-08-21 20:22:21

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