首页> 外国专利> MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN

MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN

机译:内置在板上的多层陶瓷电容器,其制造方法以及其中包含有多层陶瓷电容器的制造板的方法

摘要

There is provided a multilayer ceramic capacitor to be embedded in a board, including: a ceramic body; first and second internal electrodes alternately exposed through end surfaces of the ceramic body; first and second external electrodes formed on end surfaces of the ceramic body; and first and second plating layers enclosing the first and second external electrodes, wherein when distance from one end of bands of the first or second external electrode to the other end thereof is ‘A’ and distance between points at which a virtual line drawn from a point vertically spaced apart from a surface of the first or second plating layer at a point ½×A from one end of the bands inwardly of the ceramic body by 3 μm in length direction of the ceramic body intersects points on the surface of the first or second plating layer is ‘B,’ B/A≧0.6.
机译:提供了一种多层陶瓷电容器,其嵌入在板上,包括:陶瓷体;和第一和第二内部电极通过陶瓷体的端面交替暴露。在陶瓷体的端面上形成的第一外部电极和第二外部电极。以及包围第一外部电极和第二外部电极的第一电镀层和第二电镀层,其中,当从第一外部电极或第二外部电极的带的一端到另一端的距离为“ A”时,从点画虚拟线的点之间的距离为与第一或第二镀层的表面在垂直方向上隔开的点在陶瓷体的长度方向上从陶瓷体向内的带的一端以1/2×A的点在陶瓷体的长度方向上相隔3μm,该点与第一或第二镀层的表面上的点相交第二镀层为“ B”,B /A≥0.6。

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