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Effect of Structural Factors on the Bending Strength of Multilayer Ceramic Capacitors Mounted on the Printed Circuit Board.

机译：结构因素对印刷电路板上安装多层陶瓷电容器弯曲强度的影响。

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Shinichi Sato; Katsuhiko Igarashi; Takashi Kamiya; Takeshi Nomura;
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年度 1995
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1. Control of Stress Concentration in Surface-Mounted Multilayer Ceramic Capacitor Subjected to Bending [J] . Kun-Yen Chen, Chang-Wei Huang, Marklaw Wu, Journal of the American Ceramic Society . 2014,第4期

机译：表面安装多层陶瓷电容器弯曲时应力集中的控制
2. Dynamic analysis of multilayer ceramic capacitor for vibration reduction of printed circuit board [J] . Kim Dongjoon, Kim Wheejae, Kim Wan-Chin Journal of Mechanical Science and Technology . 2019,第4期

机译：多层陶瓷电容器的动态分析印刷电路板振动减振
3. Simulation and Characterization for the Non-linearity of Multilayer Ceramic Capacitors with New Equivalent Circuits under Ac-field [J] . Hyeon-Pyo Jeon, Youn-Kyu Choi, Sang-Woo Kim, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2007,第1期

机译：交流场下新型等效电路的多层陶瓷电容器非线性特性的仿真与表征
4. Four-point-bending experiments on multilayer ceramic capacitors: Microstructural details on crack initiation and propagation [C] . Joseph Al Ahmar, Erik Wiss, Steffen Wiese International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2018

机译：多层陶瓷电容器的四点弯曲实验：裂纹萌生和扩展的微观结构细节
5. Surface mount DC/DC converter attachment to printed circuit board. [D] . Sani-Bakhtiari, Paymon. 2002

机译：将表面安装的DC / DC转换器固定到印刷电路板上。
6. Reliability of X7R Multilayer Ceramic Capacitors During High Accelerated Life Testing (HALT) [O] . Ana María Hernández-López, Juan Antonio Aguilar-Garib, Sophie Guillemet-Fritsch, 2018

机译：X7R多层陶瓷电容器在高加速寿命测试（HALT）期间的可靠性
7. Trends in High Density Packaging Technologies 1. Some Considerations on the Reliability of Copper Circuits in the Build-up Multilayer Printed Wiring Board. [O] . Masahito ISHII 1998

机译：高密度包装技术的趋势1.关于堆积多层印刷配线板中铜路电路可靠性的一些考虑因素。
8. Determination of Strength for Reliability Analysis of Multilayer Ceramic Capacitors [R] . Breder, K. , Bridge, R. J. , Kirkland, T. P. , 1999

机译：多层陶瓷电容器可靠性分析强度的确定

Effect of Structural Factors on the Bending Strength of Multilayer Ceramic Capacitors Mounted on the Printed Circuit Board.

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