Reliability of Ceramic Multilayer Boards

摘要

The objective of the program was threefold: one, to bring up-to-date the current literature and information presently available in this very new packaging technology of ceramic multilayers; two, to construct a simple circuit of sufficient interwiring density that would require at least four wiring levels and a representative materials technology; and three, a test series that would create sufficient environmental stress to be able to assess the quality of the systems involved. (Author)