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Method and apparatus for measuring the density of impurities and defects in the semiconductor wafer or /

机译:测量半导体晶片或/中杂质和缺陷的密度的方法和设备

摘要

To measure the density of defects and impurities in a semiconductor wafer and / or current to flow through the first value to the semiconductor wafer having a substrate of semiconductor material. Upon irradiation with light pulse on the semiconductor wafer, to increase the current to a value by a second electron-hole pairs generated in the semiconductor wafer in in response to the optical pulse. After the end of the irradiation of the light pulse, I will measure the rate of change toward the first value from the second value of the current. As a function of the rate of change, the density of impurities is measured and defects of the semiconductor wafer / or.
机译:为了测量半导体晶片中的缺陷和杂质的密度和/或流经第一值到具有半导体材料衬底的半导体晶片的电流。当在半导体晶片上照射光脉冲时,通过响应于光脉冲在半导体晶片中产生的第二电子-空穴对,将电流增加到一个值。在光脉冲照射结束后,我将测量从电流的第二值到第一值的变化率。作为变化率的函数,测量杂质的密度和/或半导体晶片的缺陷。

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