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Method for fabricating a wafer level package having through wafer vias for external package connectivity
Method for fabricating a wafer level package having through wafer vias for external package connectivity
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机译:具有用于外部封装连接性的具有晶片通孔的晶片级封装的制造方法
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摘要
According to an exemplary embodiment, a method for fabricating a wafer level package includes forming a polymer layer on a device wafer, where the device wafer includes at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The method further includes bonding a protective wafer to the device wafer. The method further includes forming at least one via in the protective wafer, where the at least one via extends through the protective wafer and is situated over the at least one device wafer contact pad. The method further includes forming at least one protective wafer contact pad on the protective wafer, where the at least one protective wafer contact pad is situated over the at least one via and electrically connected to the at least one device wafer contact pad.
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