首页> 外国专利> MOS TRANSISTOR, METHOD FOR MANUFACTURING THE MOS TRANSISTOR, CMOS SEMICONDUCTOR DEVICE INCLUDING THE MOS TRANSISTOR, AND SEMICONDUCTOR DEVICE INCLUDING THE CMOS SEMICONDUCTOR DEVICE

MOS TRANSISTOR, METHOD FOR MANUFACTURING THE MOS TRANSISTOR, CMOS SEMICONDUCTOR DEVICE INCLUDING THE MOS TRANSISTOR, AND SEMICONDUCTOR DEVICE INCLUDING THE CMOS SEMICONDUCTOR DEVICE

机译:MOS晶体管,制造MOS晶体管的方法,包括MOS晶体管的CMOS半导体器件以及包括CMOS半导体器件的半导体器件

摘要

A MOS transistor includes a silicon substrate, a gate insulating film disposed on the silicon substrate, a gate electrode disposed on the gate insulating film, source/drain regions disposed at both sides of the gate electrode, and a stress-generating region containing a stress-generating substance. The stress-generating region is disposed within the silicon substrate away from a surface of the silicon substrate, between the source/drain regions, and under the gate electrode.
机译:MOS晶体管包括:硅基板,设置在该硅基板上的栅极绝缘膜,设置在该栅极绝缘膜上的栅电极,设置在该栅电极的两侧的源极/漏极区域以及包含应力的应力产生区域。 -产生物质。应力产生区域设置在硅基板内,远离硅基板的表面,在源极/漏极区域之间以及在栅电极下方。

著录项

  • 公开/公告号US2008142855A1

    专利类型

  • 公开/公告日2008-06-19

    原文格式PDF

  • 申请/专利权人 KEIJI IKEDA;TOSHIHIKO MIYASHITA;

    申请/专利号US20070958615

  • 发明设计人 KEIJI IKEDA;TOSHIHIKO MIYASHITA;

    申请日2007-12-18

  • 分类号H01L29/94;H01L21/8238;

  • 国家 US

  • 入库时间 2022-08-21 20:15:58

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