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Two step process for post ash cleaning for Cu/low-k dual damascene structure with metal hard mask
Two step process for post ash cleaning for Cu/low-k dual damascene structure with metal hard mask
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机译:具有金属硬掩膜的Cu / low-k双镶嵌结构的两步除灰工艺
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摘要
A method and apparatus for removing residue on a wafer is described. A first solution is applied to remove a first type of residue from a metal mask on the wafer. A second solution is applied to remove a second type of residue from the metal mask on the wafer.
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